The xSPI standard establishes mechanical, electrical and transactional guidelines for developing high-throughput octal devices, such as the EcoXiP product, and provides users with assurance of controller compatibility with peripheral devices.
“Divergent products with different solutions to speed communication between the host controller and memory can confuse controller designers as to which direction to follow,” said
A growing number of products targeting the internet of things such as Wi-Fi and LTE communications modules, wearables, point-of-sale controllers and other embedded devices need more program memory than what can be implemented economically on-chip using embedded Flash or SRAM. Together, projections for these devices total production in the hundreds of millions annually. Standalone DRAM devices are also not an attractive solution to be used as program memory in these applications due to standby power requirements and cost. Until now, to hit performance targets, system designers have been required to invest in memory solutions that are expensive, power-hungry and performance limiting.
Built on an innovative memory and protocol architecture, Adesto’s EcoXiP product family overcomes these challenges. The EcoXiP family is an eXecute-in-Place memory that eliminates the need for on-chip embedded flash, while more than doubling processor performance, lowering system power consumption and reducing system cost compared to quad serial peripheral interface (SPI) devices.
The new JEDEC xSPI standard which was developed by a task force comprised of representatives from most NOR Flash device manufacturers and several PC and microcontroller companies, defines its primary applications as computing, automotive,
“While many of our peers will target their devices to accelerate systems’ boot speed, EcoXiP not only provides this functionality, but also delivers the lowest power eXecute-in-Place performance,” said Intrater. “This virtually eliminates the need for on-board flash to store firmware.”
“Realtek’s ICs, such as our controllers for the digital home and Wi-Fi System-on-Chip devices, include a variety of solutions that offer high performance and ultra-low energy consumption,” said
“We’re driving the future of smart, connected IoT products and we engage with partners that can bring their specialized expertise and the most innovative technologies to bear. Adesto’s EcoXiP is a great example of that kind of innovation,” said Emmanuel Sambuis, NXP® Semiconductors vice president, MCU & connectivity.
“The xSPI standard paves the way for the adoption of accelerated octal solutions, like Adesto’s EcoXiP memory,” said
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